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 FSUSB22 Low Power 2 Port Hi-Speed USB 2.0 (480Mbps) Switch
January 2005 Revised June 2005
FSUSB22 Low Power 2 Port Hi-Speed USB 2.0 (480Mbps) Switch
General Description
FSUSB22 is a low power high bandwidth switch specially designed for applications of the switching of high speed USB 2.0 signals in handset and consumer applications such as cell phone, digital camera, and notebook with hubs or controllers of limited USB I/O. The wide bandwidth (750MHz) of this switch allows signals to pass with minimum edge and phase distortion. Superior channel-to-channel crosstalk results in minimal interference. It is compatible with USB2.0 Hi-Speed standard.
Features
s 40dB OFF Isolation at 250MHz s 40dB non-adjacent channel crosstalk at 250MHz s 4.5: typical On Resistance (RON) s 3dB bandwidth: 750MHz s Low power consumption (1uA max) s Control input: TTL compatible s Bidirectional operation s USB Hi-Speed and Full Speed signaling capability
Applications
* Cell phone, PDA, digital camera, and notebook
Ordering Code:
Order Number FSUSB22BQX FSUSB22QSC FSUSB22QSCX_NL (Note 1) FSUSB22MTC FSUSB22MTCX_NL (Note 1) Package Number Package Description
MLP016E 16-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC MO-241, 2.5 x 3.5mm MQA16 MQA16 MTC16 MTC16 16-Lead Quarter Size Outline Package (QSOP), JEDEC MO-137, 0.150" Wide Pb-Free 16-Lead Quarter Size Outline Package (QSOP), JEDEC MO-137, 0.150" Wide 16-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide Pb-Free 16-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Devices also available in Tape and Reel. Specify by appending suffix letter "X" to the ordering code. Pb-Free package per JEDEC J-STD-020B. Note 1: "_NL" indicates Pb-Free package (per JEDEC J-STD-020B). Device available in Tape and Reel only.
(c) 2005 Fairchild Semiconductor Corporation
DS500899
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FSUSB22
Analog Symbol
Connection Diagrams
Pin Assignments for QSOP and TSSOP
Pin Descriptions
Pin Name OE S A B1-B2 Description Bus Switch Enable Select Input Bus A Bus B
Pad Assignments for DQFN
Truth Table
S X L H OE H L L Function Disconnect A A B1 B2
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FSUSB22
Absolute Maximum Ratings(Note 2)
Supply Voltage (VCC) DC Switch Voltage (VS) DC Input Voltage (VIN) (Note 3) DC Input Diode Current (lIK) VIN 0V DC Output (IOUT) Sink Current DC VCC/GND Current (ICC /IGND) Storage Temperature Range (TSTG) ESD Human Body Model 4kV
0.5V to 4.6V 0.5V to VCC 0.05V 0.5V to 4.6V 50 mA
128 mA
Recommended Operating Conditions (Note 4)
Power Supply Operating (VCC) Input Voltage (VIN) Output Voltage (VOUT) Input Rise and Fall Time (tr, tf) Switch Control Input Switch I/O Free Air Operating Temperature (TA) 0 ns/V to 5 ns/V 0 ns/V to DC 3.0V to 3.6V 0V to VCC 0V to VCC
r100 mA 65qC to 150 qC
40 qC to 85 qC
Note 2: The Absolute Maximum Ratings are those values beyond which the safety of the device cannot be guaranteed. The device should not be operated at these limits. The parametric values defined in the Electrical Characteristics tables are not guaranteed at the absolute maximum rating. The Recommended Operating Conditions tables will define the conditions for actual device operation. Note 3: The input and output negative voltage ratings may be exceeded if the input and output diode current ratings are observed. Note 4: Unused control inputs must be held HIGH or LOW. They may not float.
DC Electrical Characteristics
Symbol VIK VIH VIL II IOFF RON Parameter Clamp Diode Voltage HIGH Level Input Voltage LOW Level Input Voltage Input Leakage Current OFF-STATE Leakage Current Switch On Resistance (Note 6) VCC (V) 3.0 3.0 - 3.6 3.0 - 3.6 3.6 3.6 3.0 3.0 5.0 4.5 0.3 1.0 1.0 2.0 0.8 TA Min
40 qC to 85 qC
Typ (Note 5) Max Units V V V IIN Conditions
1.2
18 mA
r1.0 r1.0
7.0 6.5
PA PA : : : : PA
0 d VIN d 3.6V 0 d A, B d VCC VIN ION VIN ION VIN IOUT VIN 0.8V 8 mA 3.0V 8 mA 0.8V, VIN 8 mA VCC or GND, IOUT 0 0V - 1.5V, ION 8 mA
'RON
RFLAT(ON) ICC
Delta RON On Resistance Flatness (Note 7) Quiescent Supply Current
3.0V and TA
3.0 3.0 3.6
25qC
Note 5: Typical values are at VCC
Note 6: Measured by the voltage drop between A and B pins at the indicated current through the switch. On Resistance is determined by the lower of the voltages on the two (A or B) pins. Note 7: Flatness is defined as the difference between the maximum and minimum value On Resistance over the specified range of conditions.
3
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FSUSB22
AC Electrical Characteristics
Symbol tON tOFF tPD OIRR XTALK BW Parameter Turn ON Time S-to-Bus B Turn OFF Time S-to-Bus B Propagation Delay Non-Adjacent OFF-Isolation Non-Adjacent Channel Crosstalk VCC (V) 3.0 to 3.6 3.0 to 3.6 3.0 to 3.6 3.0 to 3.6 3.0 to 3.6 3.0 to 3.6
3.3V and T A
TA Min
40qC to 85qC
Typ (Note 8) 4.5 2.5 0.25 Max 6.0 4.0 Units ns ns ns dB dB MHz CL f RL RL 10 pF 250MHz, RL 50: 50: Conditions
Figure Number Figures 5, 6 Figures 5, 6 Figure 10 Figure 7 Figure 8 Figure 9
30.0 38.0
750
50:, f 250MHz
3dB Bandwidth
Note 8: Typical values are at VCC
25qC
USB Related AC Electrical Characteristics
Symbol tSK(O) tSK(P) TJ Parameter Channel-to-Channel Skew Skew of Opposite Transition of the Same Output Total Jitter
3.3V and T A
(Note 9)
Units ns ns ns CL CL RL tR 10 pF 10 pF 50:, CL tF 10 pF Conditions Figure Number Figures 10, 11 Figures 10, 11
VCC (V) 3.0 to 3.6 3.0 to 3.6 3.0 to 3.6
25qC
TA Min
40qC to 85qC
Typ 0.051 0.020 0.210 Max
750ps at 480 Mbps
Note 9: Typical values are at VCC
Capacitance
Symbol CIN CON COFF
(Note 10)
Parameter TA
40qC to 85qC
Typ 2.5 12.0 4.5
Units pF pF pF VCC VCC 0V
Conditions
Control Pin Input Capacitance A/B ON Capacitance Port B OFF Capacitance
3.3V and TA
3.3V, OE
0V
VCC and OE
3.3V
Note 10: Typical values are at VCC
25qC
FIGURE 1. Gain vs. Frequency
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FSUSB22
FIGURE 2. OFF Isolation
FIGURE 3. Crosstalk
FIGURE 4. RON 5 www.fairchildsemi.com
FSUSB22
AC Loading and Waveforms
Note: Input driven by 50: source terminated in 50: Note: CL includes load and stray capacitance Note: Input PRR 1.0 MHz, t W 500 ns
FIGURE 5. AC Test Circuit
FIGURE 6. AC Waveforms
FIGURE 7. OFF Isolation Test
FIGURE 8. Crosstalk Test
FIGURE 9. Bandwidth Test
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6
FSUSB22
AC Loading and Waveforms
(Continued)
FIGURE 10. Propagation Delay
Pulse Skew tSK(P)
Output Skew tSK(O) FIGURE 11. Skew Test
7
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FSUSB22
Tape and Reel Specification
Tape Format for DQFN Package Designator BQX Tape Section Leader (Start End) Carrier Trailer (Hub End) TAPE DIMENSIONS inches (millimeters) Number Cavities 125 (typ) 2500/3000 75 (typ) Cavity Status Empty Filled Empty Cover Tape Status Sealed Sealed Sealed
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8
FSUSB22
Physical Dimensions inches (millimeters) unless otherwise noted
16-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC MO-241, 2.5 x 3.5mm Package Number MLP016E
9
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FSUSB22
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
16-Lead Quarter Size Outline Package (QSOP), JEDEC MO-137, 0.150" Wide Package Number MQA16
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10
FSUSB22 Low Power 2 Port Hi-Speed USB 2.0 (480Mbps) Switch
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
16-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide Package Number MTC16
Technology Description
The Fairchild Switch family derives from and embodies Fairchild's proven switch technology used for several years in its 74LVX3L384 (FST3384) bus switch product.
Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. 11 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. www.fairchildsemi.com
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